Closing the traceability gap and driving yield improvement
Serialized traceability and real-time yield control for advanced semiconductor and photonics manufacturing
Why Intraratio
Intraratio serves mission-critical manufacturers, OEMs and fabless chip vendors behind AI infrastructure build‑outs and high‑reliability electronics
— with serialized traceability and real-time yield control to compete at scale.
Powering mission-critical networking optics
Advancing AI and data center infrastructure build-outs
- Advanced optical transceivers
- High-performance cables and interconnects
- Advanced integrated packaging
AI infrastructure ∙ High-performance computing
Automotive & mobility
Defense & space
Medical device manufacturing
Quantum computing
End-to-end traceability — all manufacturing stages, from wafer to module
Wafer
SiPh ∙ MEMS ∙ CMOS
Advanced packaging
CoWoS ∙ CPO ∙ 2.5D/3D packaging
SMT/PCBA
Final assembly
End-to-end platform
Stop patchwork solutions from compounding yield risk
Disparate IoT, MES, YMS, and analytics tools lack the shared context and end-to-end visibility needed to contain yield risk at scale. Intraratio eliminates this software tool sprawl with one unified, connected platform — featuring serialized unit-level traceability across process steps and sites.
Status quo
Fragmented, multi-solution
Intraratio platform
One platform, end to end
Serialized traceability
Close every data gap with unit level traceability
Real-time visibility
Across materials, equipment, operators, and product — from wafer source through chip-on-chip assembly, optical sort, module build, and final test.
Closing the “data gap” between multi-fab processes and yield outcomes
Each unit gets its own serial number, and carries its own transactions and record history — closing the data gap between what happened across your fabs and the yield you see.
Every site gets connected
Complex multi-tier data interchange between foundries, OSATs, suppliers, assembly sites are handled automatically, with no manual exports or reconciliation.
Works with what you already have
One orchestration platform across your whole operation — so you don't have to replace working equipment to get a complete data record.
SiPh / CPO / Module Value Chain
Data Convergence for Complete E2E Traceability
Wafer
Foundries
Silicon Photonics
Advanced Packaging, Assembly & Test
In-house, OSATs, CMs
3D packaging, Optical Engine, Co-Packaged Optics
(CPO)
PCBA + Final Module Assembly
In-house, CM’s
SMT, Manual & Automated Assembly & Test
Multi-Fab, Multi-Site Unit Genealogy
One wafer/lot/die id/module serial, tracked across every fab (for IDMs)
Supply-Chain Wide Traceability Aggregation
Unified visibility across all foundry & OSAT partners for fabless chipmakers
Direct Data Capture Formats
Data Format Examples
CSV
TXT
STDF
XML
SINF
ASCII
DXF
JSON
ATDF
...
Transfer Protocol Examples
SFTP
Files
REST
SOAP
WebSocket
SECS GEM
Serialized Unit Genealogy
From Wafer to Module
Each unit gets its own
Record
Transactions
Serial number
Data Convergence (Wafer → Module)
Actionable insights
Turn real-time data into immediate action
Move from hyper-contextualized production data and yield insights to clear, prioritized actions — in real time.
Root cause analysis
From symptom to root‑cause isolation in a few clicks, not days
Give engineers the detailed, real-time context they need to identify what’s driving yield excursions and loss — and act immediately.
01
Prioritize by impact
02
Confirm and localize
03
Isolate and contain
04
Tune limits and set automated monitors
1/3
Which process steps, products, or defects are contributing most to yield loss?
Yield vs. Operation
2/3
Which process steps, products, or defects are contributing most to yield loss?
Group-By Yield Analysis
3/3
Which process steps, products, or defects are contributing most to yield loss?
Defect Analysis
1/2
Is this a real process shift?
Variability Analysis for Improved SPC Applications
2/2
Where, and on which exact die, are defects clustering?
Expansive Wafer Map Analytics · Wafer/Substrate Mapping · Gallery Bin Maps · Parametric Distribution Maps
1/1
What do the failing units have in common, and what's driving it?
Dynamic Commonality Analysis · Parametric Cross-Correlation
1/1
Are our limits optimized, and what floor event caused this shift?
Statistical Summaries (Cpk) · Parametric Data Analysis · Event Analysis / Tags
AI-ready data foundation
Give your manufacturing AI the operational context it needs
AI is only as useful as the operational context behind it. Intraratio provides a trusted, contextualized data layer that gives agents and models the production context they need to reason, act, and improve reliably.
ML automation
Turn every production cycle into an improvement loop
Real-time context lets unsupervised ML models run from day one, on clean, classified, and connected data — no code, no cleaning, no labelling.
Hyper-contextualized production data flows through preparation, modeling, and feedback to continuously identify opportunities and improve yield.
Platform
Lean, modern and scalable platform
- Direct-to-MES/YMS data infrastructure
- Rapid, low‑cost deployment and hyper‑scalability. Self-managed
- Customer owned and controlled configuration
- Transaction/output-based software pricing model
Direct-to-MES/YMS data infrastructure
Every transaction (machine, test, operator, etc.) captured at the source, in context, in real time.
- No middleware toll layer and IoT vendor lock-in.
- No artificial buffering or batch processing.
- No translation delays and no interference.
Native direct machine, supplier and IIoT data integrations
Raw data, straight to the network
Automatic context backfill — in real time
Advanced data translations — e.g., wafer maps, across suppliers and machines
10,000+
Connected machines and data sources
100+
Wafer foundry and OSAT supplier data feeds
150+
Machinery model and tooling types integrated
Direct data capture
Machinery & equipment
400G/800G/1.6T ∙ Pluggable & CPO
Test & inspection
WAT ∙ Probe ∙ Metrology ∙ AOI/AXI/CT
Floor level
Assembly (manual & automated)
Supplier data
Foundries ∙ OSATs
Enterprise systems
ERP ∙ MRP ∙ PLM
Database storage efficiency at scale
3:1
Data compression 4.5 TB → 1.5 TB
200 TB
Scale on 64 TB single-node storage
HA scale
Single node to multi-server cluster
Delivered with optimized SQL database architecture
Rapid, low‑cost deployment and hyper‑scalability. Self‑managed
Adaptable to any size of manufacturing operation.
- Meeting the scalability needs of modern semi and photonics manufacturing — across global sites and tiers.
- From NPI / initial-line (single node) to multi-lines (hyper-scale cluster) — without added IT burden.
Rapid, low-cost deployment — on low-cost server hardware within the customer IT network
Seamless integration and data security — with encryption and real-time failover replication
NPI to hyper-scale — add new lines without pausing production
Self-managed, zero IT/OT overhead
Time to full production
Single factory — Initial line
Single factory — Multi line
Line duplication within factory site
New factory — New lines
Rapid new factory and lines ramp
Proven NPI to HVM
<3 mo.
To live production, on-premise, cloud, or hybrid
99.99%
Uptime verified by customer IT
100 M+
Transaction processed and managed per day
Customer owned and controlled configuration
With direct access to your data. Build, report and scale on your own terms.
- No vendor-controlled customization and expensive contractual trap.
True in-stream analytics and automated Reporting
Real-time, customizable reporting
Open API and custom widgets
Rapid, rule-based changeovers
Custom advanced dashboard and visualizations
API, ODBC and SQL querying
Embeds directly into external analytics and BI tools — Python, JMP, Matlab, Minitab, Grafana, Tableau, etc.
Transaction/output-based software pricing model
Fully predictable — transaction volume (output) based pricing directly aligned with value, not headcount.
- Site and server based subscription licensing - pricing based on transactions and data volumes.
Unlimited users and machine data connections.
Full predictability — updates, upgrades, process change requests included.
Direct alignment with customer output, process activity, and value received.
Direct fit with customer's own per unit cost model — plugs into existing cost-per-unit / cost-per-wafer models for full transparent ROI.
Real-time 24/7 service support — real engineers, no chatbots — included plus response time guarantees.
Industries
Built for hyperscaling and high-reliability industries
Designed by domain experts for complex, high-reliability manufacturing — where zero-defect goals, aggressive ramp cycles, and costly downstream failures leave little room for blind spots.
Supported products and solutions
Advanced optical transceivers
400G/800G/1.6T ∙ Pluggable & CPO
High-performance cables & interconnects
AOC ∙ MPC fiber ∙ OCS
Advanced integrated packaging
Optical I/O chips ∙ Integrated photonics (PiC)
PCI connectivity & scale-up
Baseboards ∙ Host interface ∙ Scale-up fabrics
Substrate & interposer solutions
Fiber-optical & electronic assemblies
Fiber-optical cable assemblies
Patch cords ∙ Breakout assemblies ∙ Electromechanical builds
Advanced electronic assemblies
PCB assemblies ∙ Electromechanical builds
Advanced sensor technologies
MEMS ∙ LiDAR ∙ Optical & photonic sensors ∙ Lab-on-chip
Across all manufacturing stages end-to-end
Wafer fab
Semi-backend assembly & test
SMT & PCBA
Final device/module assembly
For mission-critical applications
AI infrastructure
AI data centers
High performance computing
High-density compute clusters
Memory & storage
HBM for AI and compute systems
Telecommunications
Metro networks conversion to short-haul optical networks
Automotive & mobility
Advanced sensing and high-reliability electronics
Medical & life sciences
Sensing, diagnostics & lab-on-chip
Defense & space
Secure optical communications and high-reliability electronics
Quantum computing
Photonic quantum computing and quantum communication
References
Trusted by global industry leaders
Enabling NextGen SiPh, PIC & CPO scale-ups and advanced research
Proven at production scale
50+
Global deployments
With 10+ K user base
100M+
Transactions per day
Processed and managed
on platform
24/7
True uptime
With self-healing architecture
<3 mo.
To live production
On premise, on cloud or hybrid
3-6 mo.
Average time-to-ROI
From yield improvements, productivity and efficiency gains
99.998%
Uptime
Verified by customer IT
Customer demonstrated platform benefits
5x
Volume capacity increase in <12 mo.
Accelerated optical transceiver demand growth supported by seamless platform transition to hyper-scale cluster. RC/DC added to new lines without pausing production.
95%
Reduction in engineering and resolution time (MTTR)
From automated data capture, real-time visibility and RCA — delivered recovered engineering time and $5M+ in annualized quality cost savings for a leading OT/AOC OEM.
>99%
Final CPO and transceiver module yield
Yield transformation: from NPI to full ramp
Achieved with RunCard & DataCard at a leading transceiver module OEM.